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this is information on a product in full production. august 2014 docid024992 rev 2 1/13 ECMF06-6HSM16 common mode filter with esd protection for high speed serial interface datasheet - production data figure 1. pin configuration (top view) features ? very large differential bandwidth to comply with hdmi full hd, mipi, usb2.0, usb3.0, display port and other high speed serial interfaces ? provides -20 db attenuation at 700 mhz in lte bands ? high common mode attenuation: -25 db between 800 mhz - 900 mhz ? very low pcb space consumption ? thin package: 0.55 mm max. ? lead-free package ? high reduction of parasitic elements through integration. complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications ? mobile phones ? notebook, laptop ? portable devices ? pnd description this device is a highly integrated common mode filter designed to suppress emi/rfi common mode noise on high speed differential serial buses like hdmi full hd, mipi, display port and other high speed serial interfaces.the device has a very large differential bandwidth to comply with these standards. the device can protect and filter 3 differential lanes. qfn-16l 4.10 x 1.35 mm 1 2 3 16 15 14 d1+ d1- gnd d1+ d1- gnd 4 5 13 12 d2+ d2- d2+ d2- 6 11 gnd gnd 7 8 10 9 d2+ d2- d2+ d2- www.st.com
characteristics ECMF06-6HSM16 2/13 docid024992 rev 2 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage iec 61000-4-2 contact discharge (connector side) air discharge (connector side) 8 16 kv i dc maximum dc current 100 ma t op operating temperature range -40 to +85 c t j maximum junction temperature 125 c t stg storage temperature range - 55 to +150 c symbol parameter v = breakdown voltage br i = leakage current @ v rm rm v = stand-off voltage rm i = breakdown current r i v i rm i r v rm v br table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 v i rm v rm = 3 v per line 100 na r dc dc serial resistance 5 table 3. pin description pin number description pin number description pin number description pin number description 1 d1+ to connector 5 d2- to connector 9 d3- to ic 13 d2+ to ic 2 d1- to connector 6gnd10 d3+ to ic 14 gnd 3gnd7 d3+ to connector 11 gnd 15 d1- to ic 4 d2+ to connector 8 d3- to connector 12 d2- to ic 16 d1+ to ic
docid024992 rev 2 3/13 ECMF06-6HSM16 characteristics 13 figure 3. differential attenuation versus frequency (z 0 diff = 100 ) figure 4. common mode attenuation versus frequency (z 0 com = 50 ) sdd21 (db) 10m 30m 100m 300m 1g 3g -5 -4 -3 -2 -1 0 f/hz lane #1 lane #2 f (hz) scc21 (db) 10m 30m 100m 300m 1g 3g -40 -35 -30 -25 -20 -15 -10 -5 0 lane #1 lane #2 f (hz)
characteristics ECMF06-6HSM16 4/13 docid024992 rev 2 figure 5. differential (z dd21 ) and common mode (z cc21 ) impedance versus frequency figure 6. esd response to iec61000-4-2 (+8 kv contact discharge) 1e7 1e8 1e9 6e9 1e1 1e2 1e3 1e4 z dd21 z cc21 () f (hz) 20 v/div 70.5 v 26.4 v 18.9 v 11.9 v 20 ns/div 1 2 4 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 3
docid024992 rev 2 5/13 ECMF06-6HSM16 characteristics 13 figure 7. esd response to iec61000-4-2 (-8 kv contact discharge) 20 v/div 20 ns/div -74.6 v -15.3 v -9.3 v -4.3 v 1 2 4 3 v : esd peak voltage pp v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 figure 8. usb2.0 480 mbps eye diagram without device figure 9. usb2.0 480 mbps eye diagram with device thru ECMF06-6HSM16
characteristics ECMF06-6HSM16 6/13 docid024992 rev 2 figure 10. usb3.0 5 gbps eye diagram without device figure 11. usb3.0 5 gbps eye diagram with device thru 250 mv/c 33.4 ps/c 250 mv/c 33.4 ps/c ECMF06-6HSM16 figure 12. hdmi 3.35 gbps eye diagram without device figure 13. hdmi 3.35 gbps eye diagram with device thru ECMF06-6HSM16
docid024992 rev 2 7/13 ECMF06-6HSM16 characteristics 13 figure 14. tdr before compensation hdmi template after compensation z (ohm) time (ns) 130 120 110 100 90 80 70 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
application information ECMF06-6HSM16 8/13 docid024992 rev 2 2 application information figure 15. hdmi schematic more application information available in following an: ? application note an4356: "antenna desense on handheld equipment" ? application note an4511: "common mode filters" ? application note an4540: "mhl link filtering and protection" d0 d1 d2 clock ecmf06 ecmf02 nc dop don gnd d1p d1n gnd clkp clkp application baseband dop don gnd d1p d1n gnd clkp clkp mipi transceiver hdmi connector hdmi asic hdmi2c1-6c1 hdp_ic sda_ic cec_ic scl_ic fault scl gnd cec vdd_cec sda gnd vdd_ic vdd_cfc_ic vdd_5v 5v_out heac- heac+ utility hpd
docid024992 rev 2 9/13 ECMF06-6HSM16 pcb layout recommendations 13 3 pcb layout recommendations figure 16. pcb layout recommendations figure 17. pcb stack dimensions 350 m 350 m 150 m 170 m 170 m 330 m 5000 m connector host pad layout differential lanes (z 0 = 100 ) differential lanes (z 0 = 100 ) 40 m 105 m r = 4.28
package information ECMF06-6HSM16 10/13 docid024992 rev 2 4 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 18. qfn-16l dimension definitions table 4. qfn-16l dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.45 0.50 0.55 0.018 0.020 0.022 a1 0.00 0.02 0.05 0.00 0.0008 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 d 4.10 0.161 e 1.35 0.053 e 0.50 0.020 l 0.40 0.50 0.60 0.016 0.020 0.024 d idex area top view side view bottom view e a e l b a1 pin # 1 id 1 8 9 16
docid024992 rev 2 11/13 ECMF06-6HSM16 package information 13 figure 21. tape and reel specifications figure 19. footprint figure 20. marking 0.20 0.50 0. 0 7 0.35 xx ww yp xx ww yp xx ww yp dot : pin 1 identification x x= marking ww= datacode (week) y=data code(year) p=assembly plant dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 12.0 1.75 5.5 ? 1.55 0.75 1.60 0.25 4.35
ordering information ECMF06-6HSM16 12/13 docid024992 rev 2 5 ordering information figure 22. ordering information scheme 6 revision history table 5. ordering information order code marking package weight base qty delivery mode ECMF06-6HSM16 kl qfn-16l 7.76 mg 3000 tape and reel ecmf 06 - 6 hs m16 function common mode filter with esd protection number of lines 06 = 6 filtered lines number of esd protected lines 6 lines with esd protection version hs = high speed package m16 = qfn-16l table 6. document revision history date revision changes 03-oct-2013 1 initial release. 25-aug-2014 2 added figure 5: differential (zdd21) and common mode (zcc21) impedance versus frequency .
docid024992 rev 2 13/13 ECMF06-6HSM16 13 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved

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